· 18 Layers Gold PCB
· 2.6 mm Board Thickness
· EM-626
· 5 Back-Drill Groups, Stub ≤ 5 mil
· 52 Impedance Groups
· Finished Dimensions 445 × 502 mm
· Insertion Loss: ≤ 1.0 dB/inch @ 16 GHz
· 26 Layers with ENIG
· 3.9 mm Board Thickness
· Gallop 8U + Gallop 6HF
· 11 Back-Drill Groups, Stub ≤ 8 mil
· 22 Impedance Groups, Inner Layer Tolerance ±8%
· 431 × 237.5 mm Finished Dimensions
· 30 Layers with ENIG
· IT-988GSE
· 3.1 ± 0.31 mm Board Thickness
· 30 Impedance Groups
· Finished Dimensions 417 × 655 mm
· Material: NY P5-Q
· Layer Count: 78 Layers (3×26L Build-up)
· Board Thickness: 15.2 mm
· Panel Size: 460 mm × 380 mm
· Structure: N+N+N
· Aspect Ratio: 25:1（Sub）
· BGA Pitch: 0.80 mm
· Warpage: 0.30%
· Stub Length: 150±50 um
· Impedance Tolerance: ±8%
· 26-Layer 7 Steps HDI with ENIG + Gold Finger High Speed Digital
· EMC EM-890K
· 7 Steps 0.1mm Micro-via + Buried Via +Through hole design
· 28-Group impedance with tolerance ±10%
· Decapping, Stepped gold fingers
· 20-Layer ENIG and Back-drill High Speed Digital
· Panasonic R-5785(GN)
· 10 Different back drill depth
· Aspect ratio of 19:1
· 24-Layer Immersion Tin with Backdrill High Speed Digital
· S7439C
· 3 Different back-drill depth
· 16-Layer 6oz Heavy Copper and Thick Board Thickness
· TUC TU-865
· 8.4mm ultra-thick board
· Depth controlled drilling
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